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【Product Change】ATP DDR4 RDIMM 2666Mhz Die change

2018/9/18

We have recently received product change notice from the manufacturer for the following products. This announcement takes effect immediately. Please review this notice carefully and contact the product manager or your regional PAPS representatives, should you have any question.


Description of the Change:

ATP Samsung DDR4-2666 module 8Gbit IC Die revision change from B die to C die


Milestone:

  • Effective Date: 2018/10/1
  • Start Date: 2018/10/1
  • Last Shipment Date: Running Change
  • Cut-in Implementation: Running Change


Affected Products:


*Should you have any question regarding products, please contact Advantech sales representative for purchasing information.

 
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